Electronic component having micro-electrical mechanical system

Details Electronic component having micro-electrical mechanical system Electronic component having micro-electrical mechanical system

2006-05-30

2006-05-30

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S417000, C257S418000, C257S420000

Reexamination Certificate

active

07053456

ABSTRACT:
An electronic component includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a cavity that penetrates from the first surface to the second surface of the semiconductor substrate, and an electrical mechanical element that has a movable portion formed above the first surface of the semiconductor substrate so that the movable portion is arranged above the cavity. The electronic component further includes an electric conduction plug, which penetrates from the first surface to the second surface of the semiconductor substrate, and which is electrically connected to the electrical mechanical element.

REFERENCES:
patent: 6074890 (2000-06-01), Yao et al.
patent: 6228675 (2001-05-01), Ruby et al.
patent: 6674159 (2004-01-01), Peterson et al.
patent: 2003/0107456 (2003-06-01), Nishihara et al.
patent: 40518794 (1993-07-01), None

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