Stencil and method for depositing material onto a substrate

Details Stencil and method for depositing material onto a substrate Stencil and method for depositing material onto a substrate

2006-10-31

2006-10-31

Smith, Matthew (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S789000, C257S790000, C029S841000, C029S855000, C438S951000

Reexamination Certificate

active

07129590

ABSTRACT:
A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.

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