4. Metal fusion bonding
  5. With means to remove, compact, or shape applied flux or filler
  6. Including wiper

Jeffrey R. Watson

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Reflow furnace for an electronic assembly

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – Including wiper
Patent

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Stencil and method for depositing material onto a substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1920059

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