Method for planarizing microelectronic workpieces

Details Method for planarizing microelectronic workpieces Method for planarizing microelectronic workpieces

2006-11-07

2006-11-07

Hail, III, Joseph J. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S041000, C451S056000, C451S443000

Reexamination Certificate

active

07131889

ABSTRACT:
Planarizing machines and methods for accurately planarizing microelectronic workpieces. Several embodiments of the planarizing machines produce a planar surface at a desired endpoint in the microelectronic workpieces by (a) quickly reducing variances on the surface of the workpiece using a planarizing medium that removes topographical features but has a low polishing rate on planar surfaces; and (b) subsequently planarizing the wafer on a planarizing medium that has a higher polishing rate on planar surfaces than the first polishing medium.

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