Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-08-08
2006-08-08
Nguyen, Ha Tran (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S455000, C438S641000, C438S637000, C438S686000
Reexamination Certificate
active
07087510
ABSTRACT:
A microelectronic component having a plurality of leads are formed at their tip end with bondable material using a process including a mask of positive photoresist material. The leads can be rendered peelable from the substrate by, for example, plasma undercutting the leads. The tip ends of the leads can be bonded to contacts on an opposing microelectronic component, and separated therefrom in horizontal direction by virtue of the peelable leads to form S-shaped leads. The space between the microelectronic components can be filled with a compliant layer to form a microelectronic package.
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Lerner David Littenberg Krumholz & Mentlik LLP
Nguyen Ha Tran
Tessera Inc.
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