Methods and apparatus for integrated circuit ball bonding...

Details Methods and apparatus for integrated circuit ball bonding... Methods and apparatus for integrated circuit ball bonding...

2006-03-07

2006-03-07

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C438S613000

Reexamination Certificate

active

07009305

ABSTRACT:
An integrated circuit comprises at least one circuit element having at least one bond site and a passivation layer. The bond site is accessible through an aperture in the passivation layer. At least two ball bumps are disposed at the bond site. A first ball bump is bonded to the bond site, and each additional ball bump is bonded on a previously bonded ball bump so that the height of the ball bumps is greater than the thickness of the passivation layer above the bond site. A ball bond is bonded to an uppermost ball bump and has a wire formed integrally therewith.

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