4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Integrated circuit structure with electrically isolated...
  6. Passive components in ics

Patrick J. Carberry

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Device packages having stable wirebonds

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Device packages having stable wirebonds

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Electrical devices having adjustable capacitance

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Electrical devices having adjustable electrical characteristics

Inductor devices – Polyphase – Adjustable inductor
Reexamination Certificate

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Methods and apparatus for integrated circuit ball bonding...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2176730

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