Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate
2006-07-11
2006-07-11
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
C438S014000
Reexamination Certificate
active
07074626
ABSTRACT:
A method and apparatus for performing intra-tool monitoring and control within a multi-step processing system. The method monitors the processing of a workpiece as the workpiece is processed by independently operating processing tools and produces control parameters for the various independently operating processing tools to optimize the processing of the workpiece. More specifically, the apparatus provides a metrology station located between each of a plurality of semiconductor wafer processing tools such that measurements can be made on wafers as they are passed from one tool to another providing intra tool monitoring. The data collected by the metrology station is coupled to a metrology data analyzer, which determines whether any of the plurality of wafer processing tools should be adjusted to improve the processing of the overall wafer. As such, the output of the metrology data analyzer provides control parameters to process controllers connected controllers connected to each of the tools within the semiconductor wafer processing system. Consequently, the operation of the metrology stations and the metrology data analyzer provides both feed forward and feed back data to control the tools based upon certain information that is gathered within the metrology station.
REFERENCES:
patent: 4411982 (1983-10-01), Shibuya
patent: 5719495 (1998-02-01), Mosiehi
patent: 5791969 (1998-08-01), Lund
patent: 5966312 (1999-10-01), Chen
patent: 6010962 (2000-01-01), Liu et al.
patent: 6110011 (2000-08-01), Somekh et al.
patent: 6132289 (2000-10-01), Labunsky et al.
patent: 6200908 (2001-03-01), Vandamme et al.
patent: 6208751 (2001-03-01), Almogy
patent: 6225223 (2001-05-01), Liu et al.
patent: 6228768 (2001-05-01), Woo et al.
patent: 6230069 (2001-05-01), Campbell et al.
patent: 6231743 (2001-05-01), Etherington
patent: 6433561 (2002-08-01), Satya
patent: 6444481 (2002-09-01), Pasadyn et al.
patent: 6489240 (2002-12-01), Iacoponi et al.
patent: 6610151 (2003-08-01), Cohen
patent: 6640151 (2003-10-01), Somekh et al.
patent: 6816806 (2004-11-01), Kocimski
patent: 6903016 (2005-06-01), Cohen
patent: 2002/0192944 (2002-12-01), Sonderman et al.
patent: 2005/0084987 (2005-04-01), Wilson et al.
patent: WO 98/54632 (1998-12-01), None
patent: WO 99/15710 (1999-04-01), None
Cheung Robin
Parikh Suketu
Applied Materials Inc.
Lebentritt Michael
Patterson & Sheridan LLP
Stevenson André
LandOfFree
Method and apparatus for providing intra-tool monitoring and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for providing intra-tool monitoring and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for providing intra-tool monitoring and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3607249