Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2006-07-18
2006-07-18
Baumeister, B. William (Department: 2891)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S781000, C438S689000, C438S758000, C427S240000, C118S052000
Reexamination Certificate
active
07078355
ABSTRACT:
A method and system of coating a polymer solution on a substrate such as a semiconductor wafer. The method includes providing a substrate. Dispensing a polymer solution onto the surface of the substrate using a pump. The pump is connected in-line with a buffer tank and a polymer solution source such that the pump draws the polymer solution from the polymer solution source and the buffer tank in a continuous fluid path to dispense the polymer solution. The polymer solution source is connected to a pressure source capable of causing a transfer of the polymer solution from the polymer solution source into the buffer tank. The buffer tank to maintain a relatively constant level of polymer solution.
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PCT International Search Report for PCT Application No. PCT/US2004/033903. Mailed Mar. 6, 2005, (7pages).
Anya Igwe U.
ASML Holding N.V.
Baumeister B. William
Blakely , Sokoloff, Taylor & Zafman LLP
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