Staggered ribs on process chamber to reduce thermal effects

Details Staggered ribs on process chamber to reduce thermal effects Staggered ribs on process chamber to reduce thermal effects

2006-09-19

2006-09-19

Lund, Jeffrie R. (Department: 1763)

Coating apparatus

Gas or vapor deposition

C118S724000, C118S725000, C118S730000, C156S345270, C156S345520, C156S345550

Reexamination Certificate

active

07108753

ABSTRACT:
A semiconductor processing chamber having a plurality of ribs on an exterior surface of the chamber is provided. The ribs are positioned relative to the chamber such that shadows cast into the chamber by the ribs are offset from one another, thus more uniformly distributing radiant energy entering the chamber. In one embodiment, the ribs are positioned on the exterior surface of the chamber so that they have dissimilar radial distances from a center of the chamber. When a substrate rotates within the chamber, shadows produced by the ribs on a first side of the chamber fall substantially between secondary shadows produced by the ribs on a second side of the chamber. Likewise, shadows produced by the ribs on the second side of the chamber fall substantially between the secondary shadows produced by the ribs on the first side of the chamber.

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Benchmark, “The ASM—Epitaxy Newsletter of Continuous Improvement”, Fall 1999.

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