Lead solder indicator and method

Details Lead solder indicator and method Lead solder indicator and method

2006-07-11

2006-07-11

Gurley, Lynne A. (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

C438S015000, C438S016000, C438S612000, C438S613000, C438S614000, C257S772000, C257S779000

Reexamination Certificate

active

07074627

ABSTRACT:
A solder system includes a lead (Pb) indicator and a solder flux. A method for forming a semiconductor device includes providing a carrier, applying the solder system to the carrier, coupling the terminal to the carrier via the solder system, melting the solder system to attach the terminal to the carrier and form a completed semiconductor device, and determining if the completed semiconductor device has a different predetermined property from the solder system.

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Tippy Wicker, New Technologies Product Feature LF Green Solder Paste, Qualitek, www.qualitek.com/technology.html.

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