Etching a substrate: processes – Etching of semiconductor material to produce an article...
Reexamination Certificate
2006-04-25
2006-04-25
Alanko, Anita (Department: 1765)
Etching a substrate: processes
Etching of semiconductor material to produce an article...
C438S710000, C438S715000, C438S723000, C438S724000, C438S732000, C216S011000, C216S059000, C216S067000, C216S070000, C977S726000
Reexamination Certificate
active
07033514
ABSTRACT:
This invention relates to a method and apparatus for forming a micromachined device, where a workpiece is plasma etched to define a microstructure. The plasma etching is conducted in the presence of a magnetic field, which can be generated and manipulated by an electric field. The magnetic field effects the electrons present in the plasma by directing them to “collect” on a desired plane or surface of the workpiece. The electrons attract the ions of the plasma to etch the desired region of the a workpiece to a greater extent than other regions of the workpiece, thereby enabling the formation of more precise “cuts” in the workpiece to form specific shapes of microstructures. The magnetic field can be controlled in direction and intensity and substrate bias power can also be controlled during etching to precisely and accurately etch the workpiece.
REFERENCES:
patent: 4668338 (1987-05-01), Maydan et al.
patent: 4729815 (1988-03-01), Leung
patent: 5079481 (1992-01-01), Moslehi
patent: 5441595 (1995-08-01), Yamagata et al.
patent: 5534108 (1996-07-01), Qian et al.
patent: 5662819 (1997-09-01), Kadomura
patent: 5932488 (1999-08-01), Takizawa et al.
patent: 5972193 (1999-10-01), Chou et al.
patent: 5976347 (1999-11-01), Wakabayashi et al.
patent: 6015476 (2000-01-01), Schlueter et al.
patent: 6020268 (2000-02-01), Cheng
patent: 6103399 (2000-08-01), Smela et al.
patent: 6194680 (2001-02-01), Watanabe et al.
patent: 6392187 (2002-05-01), Johnson
patent: 6451703 (2002-09-01), Liu et al.
patent: 6767838 (2004-07-01), Ono et al.
patent: 63153289 (1988-06-01), None
patent: 01030224 (1989-02-01), None
patent: 01270229 (1989-10-01), None
patent: 03253585 (1991-11-01), None
patent: 03278529 (1991-12-01), None
patent: 04199711 (1992-07-01), None
patent: 06291085 (1994-10-01), None
patent: WO 9532315 (1995-11-01), None
Method of Increasing the Deposition and Etch Rates in Plasma Processes, IBM Technical Disclosure Bulletin, vol. 25, No. 7A, Dec. 1982, p. 3161.
Marc Schaepkens et al.; “Asymmetric microtrenching during inductively coupled plasma oxide etching n the presence of a weak magnetic field”, Applied Physics Letters, vol. 72, No. 11, Mar. 16, 1998, pp 1293-1295.
K. Donohoe; “Aspect Ratio-Plasma Effects” Mar. 14, 2000.
“Introduction to Microengineering, Mask Design”, http://www.dbanks.demon.co.uk/ueng/maskdes.html_accessed Jul. 3, 2001.
“Introduction to Microengineering, LIGA”, http://www.dbanks.demon.co.uk/ueng/liga.html accessed Jul. 3, 2001.
“Introduction to Microengineering, Excimer laser micromachining”, http://www.dbanks.demon.co.uk/ueng/excimerum.html accessed Jul. 3, 2001.
“Introduction to Microengineering, Wafer bonding”, http://www.dbanks.demon.co.uk/ueng/waferbond.html accessed Jul. 3, 2001.
“Introduction to Microengineering, Electrochemical etching of silicon”, http://www.dbanks.demon.co.uk/ueng/electrochem.html accessed Jul. 3, 2001.
“Introduction to Microengineering, Surface micromachining”, http://www.dbanks.demon.co.uk/ueng/surfum.html accessed Jul. 3, 2001.
“Introduction to Microengineering, Basic Structures”, http://www.dbanks.demon.co.uk/ueng/sistruct.html accessed Jul. 3, 2001.
“Introduction to Microengineering, Lift off”, http://www.dbanks.demon.co.uk/ueng/liftoff.html accessed Jul. 3, 2001.
“Introduction to Microengineering, Dry Etching”, http://www.dbanks.demon.co.uk/ueng/dryetch.html accessed Jul. 3, 2001.
“Introduction to Microengineering, Wet etching”, http://www.dbanks.demon.co.uk/ueng/wetetch.html accessed Jul. 3, 2001.
“Introduction to Microengineering, Thin films”, http://www.dbanks.demon.co.uk/ueng/Thinfilms.html accessed Jul. 3, 2001.
“Introduction to Microengineering, Basic techniques”, http://www.dbanks.demon.co.uk/ueng/sitech.html accessed Jul. 3, 2001.
“Integrated MicroElectroMechanical Systems”, http://www.mdl.sandia.gov/micromachine/integrated.html accessed Jul. 3, 2001.
“Summit Technology”, http://www.mdl.sandia.gov/micromachine/trilevel.html accessed Jul. 3, 2001.
“MEMS Overview”, http://www.mdl.sandia.gov/micromachine/overview.html accessed Jul. 3, 2001.
“Vision for MEMS”, http://www.mdl.sandia.gov/micromachine/vision.html accessed Jul. 3, 2001.
Philip Ball; “Honey, I shrunk the cogs”, http://www.nature.com
su/010111/010111-3.html Jul. 12, 2001.
“Optical Microrotors” http://www.physicstoday.org/pt/vol-54/iss-3/p9.html, accessed Jul. 12, 2001.
Alanko Anita
Micro)n Technology, Inc.
LandOfFree
Method and apparatus for micromachining using a magnetic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for micromachining using a magnetic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for micromachining using a magnetic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3602468