Semiconductor wafer with improved local flatness, and method...

Details Semiconductor wafer with improved local flatness, and method... Semiconductor wafer with improved local flatness, and method...

2006-07-18

2006-07-18

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S268000, C451S269000

Reexamination Certificate

active

07077726

ABSTRACT:
A process for producing semiconductor wafers comprises simultaneous grinding of both sides of the semiconductor wafers in a single step, 1S-DDG, wherein this grinding is the only material-removing mechanical machining step which is used to machine the surfaces of the semiconductor wafers. This process produces semiconductor wafers with improved geometry and nanotopology.

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English Derwent Abstract AN 2000-015536 corresponding to DE 19823904.

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