Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2006-07-25
2006-07-25
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C257S780000, C257S781000, C257S784000, C257SE23021
Reexamination Certificate
active
07081680
ABSTRACT:
An electrical structure including a substrate and an interconnect. The substrate includes an electrically conductive and corrosion resistant metallic layer on a metal layer. The interconnect is electrically coupled to the metallic layer. A top surface of the metallic layer is above a top surface of the substrate and a bottom surface of the metallic layer is in direct mechanical contact with a first portion of a top surface of the metal layer. The metal layer is unalloyed and includes a metal.
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Metallographic Etching, Gunter Petzow, 1978, pp. 43, 50, 85, 88.
Edelstein Daniel C.
Rubino Judith M.
Sambucetti Carlos J.
Stamper Anthony K.
International Business Machines - Corporation
Sabo William D.
Schmeiser Olsen & Watts
Zarneke David A.
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