Semiconductor package having a partial slot cover for...

Details Semiconductor package having a partial slot cover for... Semiconductor package having a partial slot cover for...

2006-01-10

2006-01-10

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S783000, C257S676000, C257S784000, C257S786000, C257S684000, C257S724000, C257S668000, C257S691000, C257S796000, C257S673000, C361S707000, C361S719000, C361S783000, C029S832000, C029S841000, C174S260000

Reexamination Certificate

active

06984894

ABSTRACT:
A system and method for encapsulating an integrated circuit package. More specifically, a system and method for encapsulating a board-on-chip package is described. A strip of material is disposed on one end of the slot in the substrate to control the flow of the molding compound during the encapsulation process.

REFERENCES:
patent: 5173766 (1992-12-01), Long et al.
patent: 5353195 (1994-10-01), Fillion et al.
patent: 5571027 (1996-11-01), Roebuck et al.
patent: 5585666 (1996-12-01), Imamura
patent: 5854740 (1998-12-01), Cha
patent: 5920118 (1999-07-01), Kong
patent: 6127726 (2000-10-01), Bright et al.
patent: 6224936 (2001-05-01), Gochnour et al.
patent: 6232148 (2001-05-01), Ma et al.
patent: 6246247 (2001-06-01), Eldridge et al.
patent: 6294825 (2001-09-01), Bolken et al.
patent: 6300163 (2001-10-01), Akram
patent: 6300165 (2001-10-01), Castro
patent: 6331936 (2001-12-01), Corisis et al.
patent: 6362964 (2002-03-01), Dubhashi et al.
patent: 6373127 (2002-04-01), Baudouin et al.
patent: 6388199 (2002-05-01), Jiang et al.
patent: 6781248 (2004-08-01), Hui et al.
patent: 2002/0020908 (2002-02-01), Prindiville et al.
patent: 0698920 (1996-02-01), None
patent: 8-317605 (1996-11-01), None

Affiliated with

Also associated with

Rating

Semiconductor package having a partial slot cover for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package having a partial slot cover for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package having a partial slot cover for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3592661