Substrate for use in semiconductor manufacturing and method...

Details Substrate for use in semiconductor manufacturing and method... Substrate for use in semiconductor manufacturing and method...

2006-09-05

2006-09-05

Lee, Eddie C. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S678000, C257S676000, C257S669000, C257S670000, C257S672000, C257S687000, C257S701000

Reexamination Certificate

active

07102209

ABSTRACT:
A lead-frame based substrate panel for use in semiconductor packaging is described. The substrate panel includes a lead-frame panel having at least one array of device areas. Each device area has a plurality of contacts. The lead-frame panel is filled with a dielectric material to form a relatively rigid substrate panel that can be used for packaging integrated circuits. The top surface of the dielectric material is typically substantially coplanar with the top surface of the lead-frame panel, and the bottom surface of the dielectric material is typically substantially coplanar with the bottom surface of the lead-frame panel.

REFERENCES:
patent: 6384472 (2002-05-01), Huang
patent: 6713322 (2004-03-01), Lee
patent: 6812125 (2004-11-01), Mostafazadeh
patent: 6849944 (2005-02-01), Murtuza et al.
patent: 2003/0006055 (2003-01-01), Chien-Hung et al.

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