Method of forming wiring

Details Method of forming wiring Method of forming wiring

2006-01-10

2006-01-10

Lee, Hsien-Ming (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S149000, C438S160000, C438S164000

Reexamination Certificate

active

06984542

ABSTRACT:
A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating layer is irradiated with a laser beam with the focus position staggered.

REFERENCES:
patent: 6522014 (2003-02-01), Egitto et al.

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