Method and apparatus for heat-treating substrate

Details Method and apparatus for heat-treating substrate Method and apparatus for heat-treating substrate

1995-10-03

1997-04-15

Powell, William

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

156345, 438948, 430330, H01L 2100

Patent

active

056205600

ABSTRACT:
A heat-treating method of heating and cooling a substrate comprising the steps of carrying the wafer into a heat-treating section by a main arm and mounting the wafer on a heating stage, heating the wafer mounted on the heating stage, lifting the wafer thus heated from the heating stage, approaching a cooling holder to the wafer thus lifted to cool the wafer above the heating stage, and carrying the cooled wafer from above the heating stage.

REFERENCES:
patent: 5252807 (1993-10-01), Chizinsky

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