Polymer for photoresist and resin compositions therefor

Details Polymer for photoresist and resin compositions therefor Polymer for photoresist and resin compositions therefor

2006-09-12

2006-09-12

Hamilton, Cynthia (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C549S266000, C549S267000, C549S270000, C526S270000, C526S266000, C526S271000, C430S326000, C430S908000, C430S311000, C430S323000

Reexamination Certificate

active

07105268

ABSTRACT:
A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I):wherein R1, R2, R3, R4and R5are the same or different and are each a hydrogen atom or a methyl group; m, p and q each denote an integer of from 0 to 2; and n denotes 0 or 1, where the hydroxyl group and carbonyloxy group extending from a principle chain in the formula are independently combined with either of two carbon atoms on the far-left portion of the rings.By using the polymeric compound for photoresist as a base of a photoresist, the resulting photoresist exhibits well-rounded adhesion to substrates and resistance to etching.

REFERENCES:
patent: 6303266 (2001-10-01), Okino et al.
patent: 6746818 (2004-06-01), Kinsho et al.
patent: 2001/0026901 (2001-10-01), Maeda et al.
patent: 2003/0008232 (2003-01-01), Kinsho et al.
patent: 2004/0058269 (2004-03-01), Hada et al.
patent: 10-207069 (1998-08-01), None
patent: 2000026446 (2000-01-01), None
patent: 2000-122294 (2000-04-01), None
patent: 2000147769 (2000-05-01), None
patent: 2000-159758 (2000-06-01), None
patent: 2001-242627 (2001-09-01), None
patent: 2002371114 (2002-12-01), None
Henbest, H.B. et al, J. Chem. Soc. pp. 221-226 (1959).
Tenaglia A. et al, Tetrahedron Letter, vol. 32, No. 9, pp. 1169-1170, (1991).
Kanou et al, Publication No. 2002-371114, Patent Abstracts of Japan and attached English Machine translation of JP 2002 371114 published in Dec. 26, 2002.
Derwent-Acc-No.: 2003-370865, Derwent Information LTD, FAmily of 2001 JP -0179614 application filed Jun. 14, 2001.
Publication No.: 2000-147769, Patent Abstracts of Japan, English abstract of JP 2000-147769 published May 2000 and English Machine Translation thereof.
Publication No.: 2000-026446, Patent Abstracts of Japan, English abstract of JP 2000-26446 published Jan. 2000 and English Machine Translation thereof.
Publication No.: 2001-242627, Patent Abstracts of Japan, English abstract of JP 2000-24627 published Feb. 28, 2000 and English Machine Translation thereof.
Publication No.: 2000-122294, Patent Abstracts of Japan, English abstract of JP 2000-122294 published Mar. 28, 2000 and English Machine Translation thereof.
Partial English language translation of specification and claims 1-14 of Japanese Unexamined Patent Application Publication No. 2001-242627A (Sep. 7, 2001).
Partial English language translation of specification and claims 1-10 of Japanese Unexamined Patent Application Publication No. 2000-122294A (Apr. 28, 2000).
Partial English language translation of specification and claims 1-5 of Japanese Unexamined Patent Application Publication No. 10-207069A (Aug. 7, 1998).
Partial English language translation of specification and claims 1-7 of Japanese Unexamined Patent Application Publication No. 2000-159758A (Jun. 13, 2000).

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