Process for producing printed circuit boards

Details Process for producing printed circuit boards Process for producing printed circuit boards

1984-04-06

1985-04-23

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156656, 156666, 156902, 156280, 427 97, 427 98, 427306, 430313, 430318, B05D 512, C23F 102, B44C 122, C03C 1500

Patent

active

045128294

ABSTRACT:
This invention provides a process for producing a printed circuit board characterized by the steps of drilling holes in a copper clad laminate, treating the entire surface of the laminate including the hole-defining inner surfaces with a catalyst, removing the catalyst from the surface of the copper foil of the laminate by mechanically cleaning the surface of the copper foil, depositing electroless nickel only on the hole-defining inner surfaces, forming a pattern with an etching resist, etching away the copper foil except at the pattern area, removing the etching resist, masking with a solder resist the entire surface except at the hole-defining inner surfaces and the lands, and subjecting the hole-defining inner surfaces and the lands to electroless copper plating.

REFERENCES:
patent: 3811973 (1974-05-01), Lesh et al.
patent: 4268349 (1981-05-01), Hacke et al.
patent: 4285991 (1981-08-01), Gedrat et al.
patent: 4444619 (1984-04-01), O'Hara

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