Leadframe-to-plastic lock for IC package

Details Leadframe-to-plastic lock for IC package Leadframe-to-plastic lock for IC package

2006-07-18

2006-07-18

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C438S121000

Reexamination Certificate

active

07078271

ABSTRACT:
Disclosed is a method of making a mold lock for bonding leadframe-to-plastic in an IC package. Steps include providing niches from opposing sides of the leadframe. The opposing niches are arranged such that an aperture and a mechanical key are formed within the leadframe material by the partial intersection of the niches. The key is encapsulated with mold compound to form a lock. An IC package mold lock in a leadframe is also disclosed, the lock having an aperture, a key, and mold compound encapsulating the key. Additionally, an IC package employing the leadframe-to-plastic lock is disclosed.

REFERENCES:
patent: 4862246 (1989-08-01), Masuda et al.
patent: 6483178 (2002-11-01), Chuang
patent: 6576989 (2003-06-01), Hong et al.

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