Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
Inventor
active
Lead frame type plastic ball grid array package with...
Leadframe-to-plastic lock for IC package
Leadframe-to-plastic lock for IC package
Method for reducing stress concentrations on a semiconductor...
Method for reducing stress concentrations on a semiconductor...
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Profile ID: LFUS-PAI-P-1747858