4. Metal fusion bonding
  5. With means to juxtapose and bond plural workpieces
  6. Wire lead bonder

Richard L. Mahle

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Lead frame type plastic ball grid array package with...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Leadframe-to-plastic lock for IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Leadframe-to-plastic lock for IC package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for reducing stress concentrations on a semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

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Method for reducing stress concentrations on a semiconductor...

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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