Miniature microdevice package and process for making thereof

Details Miniature microdevice package and process for making thereof Miniature microdevice package and process for making thereof

2006-07-18

2006-07-18

Norton, Nadine G. (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

C216S018000, C216S020000

Reexamination Certificate

active

07077969

ABSTRACT:
The present invention is concerned with a miniature microdevice package and a process of making thereof. The package has a miniature frame substrate made of a material selected from the group including: ceramic, metal and a combination of ceramic and metal. The miniature frame substrate has a spacer delimiting a hollow. The package also includes a microdevice die having a microdevice substrate, a microdevice integrated on the microdevice substrate, bonding pads integrated on the microdevice substrate, and electrical conductors integrated in the microdevice substrate for electrically connecting the bonding pads with the microdevice. The microdevice die is mounted on the spacer to form a chamber. The microdevice is located within the chamber. The bonding pads are located outside of the chamber.

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