Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2006-01-31
2006-01-31
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C257S415000, C073S514290
Reexamination Certificate
active
06991957
ABSTRACT:
A method for suspending a movable structure form a support structure wherein first and second flat and thin arcuately shaped flexures are formed having spaced apart substantially planar and parallel opposing surfaces, each of the first and second flexures being structured for connection between a support structure and a movable structure to be suspended from the support structure and being aligned along a common axis of rotation between the support structure and the movable structure.
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ABSTRACT, Patent Abstracts of Japan, Publication No. 10104263, Publication Date: Apr. 24, 1998.
Application No. JP19960279995 19961001; Muro Hideo, et al. “Semiconductor Acceleration Sensor and Manufacture Thereof”.
Honeywell International , Inc.
Rupnick Attorney at Law Charles J.
Thai Luan
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