Flip-chip package and fabricating process thereof

Details Flip-chip package and fabricating process thereof Flip-chip package and fabricating process thereof

2006-05-30

2006-05-30

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S734000, C257S738000

Reexamination Certificate

active

07052935

ABSTRACT:
A flip-chip package is described. The flip-chip package includes a chip, a substrate, supporters and electrically conductive adhesive bumps. The electrically conductive adhesive bumps are located between the chip and the substrate electrically connecting the bonding pads on the former and the bump pads on the latter, wherein each electrically conductive adhesive bump has a smaller diameter at the central portion thereof than at the end portions thereof. The supporters are also disposed between the chip and the substrate surrounding the active area of the chip, so that the chip can be supported on the substrate.

REFERENCES:
patent: 6448665 (2002-09-01), Nakazawa et al.
patent: 6689635 (2004-02-01), Cobbley et al.
patent: 2004/0036170 (2004-02-01), Lee et al.
patent: 2004/0169275 (2004-09-01), Danvir et al.
patent: 2005/0056946 (2005-03-01), Gilleo

Affiliated with

Also associated with

Rating

Flip-chip package and fabricating process thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip-chip package and fabricating process thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip package and fabricating process thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3559245