4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Tsung-Ming Pai

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Flip-chip package and fabricating process thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method for fabricating a stacked chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Method for fabricating a stacked chip package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method for fabricating stacked chip package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Stacked semiconductor chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2448429

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