Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-07-25
2006-07-25
Nguyen, Tuan H. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S605000
Reexamination Certificate
active
07081401
ABSTRACT:
A p-type ohmic electrode in a gallium nitride based(GaN based) optical device and a fabrication method thereof. The p-type ohmic electrode in a GaN based optical device is fabricated using a rutile structure transition metal layer, such as an Ru, Ir or Os layer, or an oxide layer thereof, or using a double layer comprised of an Ru layer as a base layer and an Ni layer, an ITO layer or an AuO layer on the Ru layer. Thus, the p-type ohmic electrode is good in light transmittance and is thermally stable while having low contact resistance with the p-GaN layer.
REFERENCES:
patent: 6100174 (2000-08-01), Takatani
patent: 6319808 (2001-11-01), Ho et al.
patent: 6326294 (2001-12-01), Jang et al.
patent: P1997-0077764 (1997-12-01), None
patent: P1999-0088218 (1999-12-01), None
Jang Ho Won
Lee Jong Lam
Nguyen Tuan H.
Pohang University of Science and Technology Foundation
Rothwell Figg Ernst & Manbeck
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