Mold making method for wafer scale caps

Details Mold making method for wafer scale caps Mold making method for wafer scale caps

2006-04-11

2006-04-11

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S026000, C438S051000, C438S055000, C438S064000, C438S106000, C438S112000, C438S124000, C438S127000, C438S126000, C438S594000

Reexamination Certificate

active

07026176

ABSTRACT:
Disclosed is a method for fabricating a mold. The mold is used for protective caps which will be applied to a wafer. The method comprises the steps of fabricating first and second cooperating mold halves from a semiconductor material using lithography. The first half and second half, when brought together define mold cavities for the wafer scale protective caps.

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