Method and apparatus for transferring a wafer

Details Method and apparatus for transferring a wafer Method and apparatus for transferring a wafer

2006-01-31

2006-01-31

Lillis, Eileen D. (Department: 3652)

Material or article handling

Vertically swinging load support

C414S935000, C414S941000, C901S015000

Reexamination Certificate

active

06991419

ABSTRACT:
The present invention relates to a transfer apparatus for a wafer, in which the wafer may be transferred in a narrow space by reducing a transfer device footprint. The transfer device has a base, a lower arm, an upper arm and a hand. The lower arm is configured to be vertically adjustable and rotatable on a vertical axis. The upper arm is pivotably coupled to the lower arm, and the hand is horizontally coupled to the upper arm.

REFERENCES:
patent: 2933205 (1960-04-01), MacDonald
patent: 3033059 (1962-05-01), Melton
patent: 4382743 (1983-05-01), Newell
patent: 4685861 (1987-08-01), Huetsch
patent: 4699556 (1987-10-01), Foulke
patent: 5004399 (1991-04-01), Sullivan et al.
patent: 5550953 (1996-08-01), Seraji
patent: 5720590 (1998-02-01), Hofmeister
patent: 5807449 (1998-09-01), Hooker et al.
patent: 5879460 (1999-03-01), Begin et al.
patent: 6092971 (2000-07-01), Balg et al.
patent: 6155768 (2000-12-01), Bacchi et al.
patent: 6234738 (2001-05-01), Kimata et al.
patent: 6305895 (2001-10-01), Ozawa et al.
patent: 6382902 (2002-05-01), Sugimura
patent: 6450757 (2002-09-01), Saeki et al.
patent: 6491491 (2002-12-01), Tsuneda et al.
patent: 10-275848 (1998-11-01), None
patent: 2000-195922 (2000-07-01), None
English language abstract for Japanese Patent No. 10-275848.
English language of Abstract for Japanese Patent No. 2000-195922, filed Jul. 14, 2000.

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