Photoresist polymers and photoresist compositions comprising...

Details Photoresist polymers and photoresist compositions comprising... Photoresist polymers and photoresist compositions comprising...

2006-03-14

2006-03-14

Walke, Amanda (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C526S072000, C525S050000

Reexamination Certificate

active

07011924

ABSTRACT:
Photoresist polymers and photoresist compositions containing the same are disclosed that comprise a chain linking compound including an alcohol group and a boron compound represented by Formula 1 as a moiety. As a result, the photoresist polymer and the photoresist composition containing the same have excellent transmissivity, etching resistance, thermal resistance and adhesive property, low light absorbance and high affinity to an developing solution at a wavelength of 13 nm as well as 248 nm and 157 nm, thereby reducing line edge roughness (LER).wherein R1, R2, R3, R4and R5are as defined in the specification.

REFERENCES:
patent: 6403281 (2002-06-01), Lee et al.
patent: 6818376 (2004-11-01), Lee et al.
patent: 2003/0044840 (2003-03-01), Hall
patent: 2004331966 (2004-11-01), None
patent: WO 200483263 (2004-09-01), None

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