Method of making a semiconductor chip assembly with a bumped...

Details Method of making a semiconductor chip assembly with a bumped... Method of making a semiconductor chip assembly with a bumped...

2006-09-26

2006-09-26

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S738000

Reexamination Certificate

active

07112521

ABSTRACT:
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the routing line and the bumped terminal, then forming an encapsulant, and then etching the metal base to form a metal pillar that contacts the bumped terminal.

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