Method of fabricating a connection device

Details Method of fabricating a connection device Method of fabricating a connection device

2006-07-11

2006-07-11

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S629000, C438S639000

Reexamination Certificate

active

07074707

ABSTRACT:
A connection device includes a plurality of re-configurable vias that connect a first metal layer to a second metal layer. An actuating element is disposed between the first metal layer and the second metal layer. The actuating element changes the configuration of the plurality of re-configurable vias to change the plurality of re-configurable vias between a conductive state and a non-conductive state.

REFERENCES:
patent: 6469364 (2002-10-01), Kozicki
patent: 6815266 (2004-11-01), Rodgers et al.
patent: 2003/0081533 (2003-05-01), Gibson

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