Semiconductor device and method of fabricating same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S061000, C257S403000, C257S902000

Reexamination Certificate

active

07081646

ABSTRACT:
There are disclosed TFTs that have excellent characteristics and can be fabricated with a high yield. The TFTs are fabricated, using an active layer crystallized by making use of nickel. Gate electrodes are comprising tantalum. Phosphorus is introduced into source/drain regions. Then, a heat treatment is performed to getter nickel element in the active layer and to drive it into the source/drain regions. At the same time, the source/drain regions can be annealed out. The gate electrodes of tantalum can withstand this heat treatment.

REFERENCES:
patent: 4892835 (1990-01-01), Rabinzohn et al.
patent: 5403772 (1995-04-01), Zhang et al.
patent: 5426064 (1995-06-01), Zhang et al.
patent: 5459090 (1995-10-01), Yamazaki et al.
patent: 5481121 (1996-01-01), Zhang et al.
patent: 5488000 (1996-01-01), Zhang et al.
patent: 5492843 (1996-02-01), Adachi et al.
patent: 5501989 (1996-03-01), Takayama et al.
patent: 5508533 (1996-04-01), Takemura
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5534716 (1996-07-01), Takemura
patent: 5543352 (1996-08-01), Ohtani et al.
patent: 5550070 (1996-08-01), Funai et al.
patent: 5563426 (1996-10-01), Zhang et al.
patent: 5569610 (1996-10-01), Zhang et al.
patent: 5569936 (1996-10-01), Zhang et al.
patent: 5580792 (1996-12-01), Zhang et al.
patent: 5585291 (1996-12-01), Ohtani et al.
patent: 5589694 (1996-12-01), Takayama et al.
patent: 5595923 (1997-01-01), Zhang et al.
patent: 5595944 (1997-01-01), Zhang et al.
patent: 5604360 (1997-02-01), Zhang et al.
patent: 5605846 (1997-02-01), Ohtani et al.
patent: 5606179 (1997-02-01), Yamazaki et al.
patent: 5608232 (1997-03-01), Yamazaki et al.
patent: 5612250 (1997-03-01), Ohtani et al.
patent: 5614426 (1997-03-01), Funada et al.
patent: 5614733 (1997-03-01), Zhang et al.
patent: 5616506 (1997-04-01), Takemura
patent: 5620910 (1997-04-01), Teramoto
patent: 5621224 (1997-04-01), Yamazaki et al.
patent: 5624851 (1997-04-01), Takayama et al.
patent: 5637515 (1997-06-01), Takemura
patent: 5639698 (1997-06-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5646424 (1997-07-01), Zhang et al.
patent: 5654203 (1997-08-01), Ohtani et al.
patent: 5656825 (1997-08-01), Kusumoto et al.
patent: 5663077 (1997-09-01), Adachi et al.
patent: 5677549 (1997-10-01), Takayama et al.
patent: 5696386 (1997-12-01), Yamazaki
patent: 5696388 (1997-12-01), Funada et al.
patent: 5700333 (1997-12-01), Yamazaki et al.
patent: 5705829 (1998-01-01), Miyanaga et al.
patent: 5712191 (1998-01-01), Nakajima et al.
patent: 5764321 (1998-06-01), Koyama et al.
patent: 5773846 (1998-06-01), Zhang et al.
patent: 5808321 (1998-09-01), Mitanaga et al.
patent: 5815226 (1998-09-01), Yamazaki et al.
patent: 5837619 (1998-11-01), Adachi et al.
patent: 5843225 (1998-12-01), Takayama et al.
patent: 5864151 (1999-01-01), Yamazaki et al.
patent: 5869363 (1999-02-01), Yamazaki et al.
patent: 5888858 (1999-03-01), Yamazaki et al.
patent: 5897347 (1999-04-01), Yamazaki et al.
patent: 5915174 (1999-06-01), Yamazaki et al.
patent: 5946560 (1999-08-01), Uochi et al.
patent: 5952708 (1999-09-01), Yamazaki
patent: 5961743 (1999-10-01), Yamazaki et al.
patent: 5966594 (1999-10-01), Adachi et al.
patent: 5977559 (1999-11-01), Zhang et al.
patent: 5990542 (1999-11-01), Yamazaki
patent: 6060725 (2000-05-01), Zhang et al.
patent: 6066518 (2000-05-01), Yamazaki
patent: 6072193 (2000-06-01), Ohnuma et al.
patent: 6087679 (2000-07-01), Yamazaki et al.
patent: 6118506 (2000-09-01), Yamazaki et al.
patent: 6121660 (2000-09-01), Yamazaki et al.
patent: 6133075 (2000-10-01), Yamazaki et al.
patent: 6133119 (2000-10-01), Yamazaki
patent: 6169293 (2001-01-01), Yamazaki
patent: 6210997 (2001-04-01), Adachi et al.
patent: 6239470 (2001-05-01), Yamazaki
patent: 6251712 (2001-06-01), Tanaka et al.
patent: 6261875 (2001-07-01), Zhang et al.
patent: 6441468 (2002-08-01), Yamazaki
patent: 6445059 (2002-09-01), Yamazaki
patent: 6465284 (2002-10-01), Adachi et al.
patent: 6518102 (2003-02-01), Tanaka et al.
patent: 6541313 (2003-04-01), Zhang et al.
patent: 6787887 (2004-09-01), Yamazaki
patent: 6800875 (2004-10-01), Yamazaki
patent: 6830617 (2004-12-01), Ohtani et al.
patent: 6855580 (2005-02-01), Tanaka et al.
patent: 6867434 (2005-03-01), Yamazaki
patent: 6939749 (2005-09-01), Zhang et al.
patent: 2001/0019860 (2001-09-01), Adachi et al.
patent: 2002/0048894 (2002-04-01), Zhang et al.
patent: 2003/0134459 (2003-07-01), Tanaka et al.
patent: 2003/0162337 (2003-08-01), Zhang et al.
patent: 2005/0037554 (2005-02-01), Ohtani et al.
patent: 05-109737 (1993-04-01), None
patent: 06-267978 (1994-09-01), None
patent: 07-066426 (1995-03-01), None
patent: 07-202209 (1995-08-01), None
patent: 408213317 (1996-09-01), None
patent: 08-330602 (1996-12-01), None
patent: 09-045616 (1997-02-01), None
Wolf et al., Silicon Processing for the VLSI Era (1990), Lattice Press, vol. 2, p. 186.
Merriam-Webster'Collegiate Dictionary (2001), Merriam-Webster Inc., Tenth Edition, pp. 164, 535 and 994.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method of fabricating same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of fabricating same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of fabricating same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3537214

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.