Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-09-26
2006-09-26
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S113000, C438S464000
Reexamination Certificate
active
07112467
ABSTRACT:
Structure and method for temporarily holding at least one integrated circuit chip during packaging thereof are presented. A support plate has a release film secured to a main surface thereof. The support plate and release film allow UV light to pass therethrough. A UV curable chip adhesive is disposed over the release film for holding the at least one integrated circuit chip. After placement of the at least one integrated circuit chip in the UV curable chip adhesive, the UV curable chip adhesive is cured by UV light shone through the support plate and release film. As one example, the release film includes a UV release adhesive and the UV curable chip adhesive and UV release adhesive have a differential response to UV light which allows curing of the UV curable chip attach without release of the UV release adhesive.
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Eichelberger Charles W.
Starenas Paul V.
EPIC Technologies, Inc.
Heslin Rothenberg Farley & & Mesiti P.C.
Hutton, Esq. Brett M.
Picardat Kevin M.
Radigan, Esq. Kevin P.
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