Writing device and writing method

Details Writing device and writing method Writing device and writing method

2006-03-21

2006-03-21

McPherson, John A. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C355S063000, C355S067000, C347S250000, C347S239000

Reexamination Certificate

active

07014986

ABSTRACT:
A writing device is provided which, in simple processes, can write in two dimensions and three dimensions, and which can form highly accurate patterns. An exposure head, a conductive material discharging head, and an insulating material discharging head are disposed at one scanning stage. At the one scanning stage, a pattern can be formed on a printed board which is on the scanning stage. As a result, processes can be simplified, time between patternings can be shortened, and pattern formation can be made to be faster. Moreover, positional offset of the exposure head and the discharging heads with respect to the printed board does not arise. Thus, it is easy to increase a density of a pattern, and a highly accurate pattern is formed.

REFERENCES:
patent: 5602620 (1997-02-01), Miyazaki et al.
patent: 6573924 (2003-06-01), Miyagawa et al.
patent: 2002/0158961 (2002-10-01), Sawano et al.
patent: 2003/0214571 (2003-11-01), Ishikawa et al.
patent: 2003/0222966 (2003-12-01), Shirota
patent: 10-112579 (1998-04-01), None
patent: 10-112585 (1998-04-01), None
patent: 11-163499 (1999-06-01), None
patent: 11-253860 (1999-09-01), None
patent: 11-274671 (1999-10-01), None
patent: 2001-56567 (2001-02-01), None
patent: 2001-125274 (2001-05-01), None

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