Method for forming a semiconductor device with a hard mask...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S763000, C438S791000, C438S792000

Reexamination Certificate

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06924229

ABSTRACT:
A method for forming a semiconductor device having improved characteristics and reliability by forming a hard mask layer on a bit line to prevent degradation of characteristics of the device in a self-alignment contact process of a storage electrode is disclosed. The hard mask layer utilizes over-hang formed at the upper portion of the bit line so as to provide sufficient protection for the bit line in the subsequent etching processes.

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patent: 5387533 (1995-02-01), Kim
patent: 5824582 (1998-10-01), Tseng
patent: 6010933 (2000-01-01), Cherng
patent: 6077743 (2000-06-01), Chen
patent: 6184081 (2001-02-01), Jeng et al.
patent: 6211091 (2001-04-01), Lien et al.
patent: 6268280 (2001-07-01), Kohyama
patent: 6436783 (2002-08-01), Ono et al.
patent: 6458692 (2002-10-01), Kim
patent: 2001/0046737 (2001-11-01), Ahn et al.

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