Method for producing a heat spreader and semiconductor device wi

Details Method for producing a heat spreader and semiconductor device wi Method for producing a heat spreader and semiconductor device wi

1998-05-01

2000-03-07

Cuda, Irene

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

29890039, 29890054, B23P 1526

Patent

active

060323620

ABSTRACT:
A heat spreader for a semiconductor device is constituted by an integral laminate of alternatingly stacked and diffusion-bonded Fe--Ni alloy sheets and copper-group metal sheets, the laminate having a one-directional stripe pattern of the Fe--Ni alloy sheets and the copper-group metal sheets, which appears on a planar surface on which a silicon chip is disposed. It is produced by (a) alternatingly stacking Fe--Ni alloy sheets and copper-group metal sheets, (b) hot isostatic-pressing the resulting stack of the metal sheets to form a slab, (c) rolling the slab vertically to the laminating direction of the metal sheets to form an integrated stripe-pattern laminate, and (d) cutting the integrated stripe-pattern laminate to a predetermined shape.

REFERENCES:
patent: 4810563 (1989-03-01), DeGree et al.
patent: 5681663 (1997-10-01), Schaller et al.

Affiliated with

Also associated with

Rating

Method for producing a heat spreader and semiconductor device wi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing a heat spreader and semiconductor device wi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a heat spreader and semiconductor device wi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-351738