Apparatus for reducing compressed dry air usage during...

Details Apparatus for reducing compressed dry air usage during... Apparatus for reducing compressed dry air usage during...

2005-12-20

2005-12-20

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S024000, C451S285000, C451S303000

Reexamination Certificate

active

06976906

ABSTRACT:
A chemical mechanical planarization (CMP) system is provided. The system includes a polishing surface and a platen disposed along an underside of the polishing surface. A retaining ring surrounds the platen. The retaining ring includes a lower annular sleeve and an upper annular sleeve moveably disposed over the lower annular sleeve. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.

REFERENCES:
patent: 5722877 (1998-03-01), Meyer et al.
patent: 6336851 (2002-01-01), Shendon
patent: 6443810 (2002-09-01), Shih
patent: 6761626 (2004-07-01), de la Llera et al.

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