Wafer handling method for use in lithography patterning

Photocopying – Projection printing and copying cameras – Methods

Reexamination Certificate

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C430S022000, C355S053000, C355S072000, C355S075000

Reexamination Certificate

active

06927842

ABSTRACT:
A method utilizing a lithography system comprises a lithography patterning chamber, a wafer exchange chamber separated from the lithography patterning chamber by a first gate valve, and at least one alignment load-lock separated from the wafer exchange chamber by a second gate valve. The alignment load-lock includes an alignment stage that aligns a wafer during pump-down. The alignment load-lock can be uni-directional or bi-directional. The lithography system can include one or multiple alignment load-locks.

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