Integrated circuit substrate having laser-embedded...

Details Integrated circuit substrate having laser-embedded... Integrated circuit substrate having laser-embedded...

2005-08-16

2005-08-16

Gibson, Randy (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S262000, C257S778000

Reexamination Certificate

active

06930256

ABSTRACT:
An integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. Conductive patterns within channels on the substrate provide interconnects that are isolated by the channel sides. A dielectric material is injection-molded or laminated over a metal layer that is punched or etched. The metal layer can provide one or more power planes within the substrate. A laser is used to ablate channels on the surfaces of the outer dielectric layer for the conductive patterns. The conductive patterns are electroplated or paste screen-printed and an etchant-resistive material is applied. Finally, a plating material can be added to exposed surfaces of the conductive patterns. An integrated circuit die and external terminals can then be attached to the substrate, providing an integrated circuit having a high-density interconnect.

REFERENCES:
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4897338 (1990-01-01), Spicciati et al.
patent: 5021047 (1991-06-01), Movern
patent: 5072075 (1991-12-01), Lee et al.
patent: 5191174 (1993-03-01), Chang et al.
patent: 5229550 (1993-07-01), Bindra et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5404044 (1995-04-01), Booth et al.
patent: 5508938 (1996-04-01), Wheeler
patent: 5531020 (1996-07-01), Durand et al.
patent: 5739588 (1998-04-01), Ishida et al.
patent: 5774340 (1998-06-01), Chang et al.
patent: 6081036 (2000-06-01), Hirano et al.
patent: 6239485 (2001-05-01), Peters et al.
patent: 6316285 (2001-11-01), Jiang et al.
patent: 6365975 (2002-04-01), DiStefano et al.
patent: 6407341 (2002-06-01), Anstrom et al.
patent: 6451509 (2002-09-01), Keesler et al.
patent: 6497943 (2002-12-01), Jimarez et al.
patent: 6544638 (2003-04-01), Fischer et al.
patent: 6730857 (2004-05-01), Konrad et al.
patent: 6753612 (2004-06-01), Adae-Amoakoh et al.
patent: 6815709 (2004-11-01), Clothier et al.
NN9311589, IBM, Nov. 1, 1993.

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