Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-08-30
2005-08-30
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S612000, C438S613000, C438S615000
Reexamination Certificate
active
06936532
ABSTRACT:
A plurality of bumps is formed on a substrate. At first, a hole having a bottom is formed in a sheet, and the hole is filled with a metallic paste. Then, the sheet is stacked and positioned on the substrate so that the hole of the sheet faces an electrode of the substrate. The substrate with the sheet is heated and pressurized so that the metallic paste is sintered and bonded to the electrode so as to form the bump. Then, the sheet is separated from the substrate having the bump, so that the bump is formed on the substrate. A part of each bump does not lack, and all of the bumps are formed surely. Therefore, the bump can be formed uniformly.
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Denso Corporation
Novacek Christy
Posz Law Group , PLC
Zarabian Amir
LandOfFree
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