Method of ITO layout to make IC bear the high-volt...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000, C716S030000

Reexamination Certificate

active

06981234

ABSTRACT:
The present invention provides a method of ITO layout to make IC bear the high-volt electro static discharge, wherein the major steps include: designing the suitable circuit impedance and Layout at the position of Driver IC bonding and Interface on LCD Module(COG type) in accordance with the function and use of each pin; improving the protection function of ESD(Electro Static Discharge) in increasing the LCD Module assembly on the product of the client; wherein: connecting the pins of all VDD or VSS together at the bottom of the IC and the width of ITO layout spreading over the bottom of IC without influencing the layout of other pins after connecting VSS or VDD. Discharge the static electricity that enters the position of Module Interface and dissipate the electro static discharge by means of the ITO layout design of the big area to improve the protection ability of IC for the electro static discharge. Serial connect an extremely high impedance(3K˜50K Ω) in the Reset Pin. Increase the value (100˜1000 Ω) of ITO circuit impedance of Date bus, such as CS1.D/C,WR,RD,D0˜D7,C86 etc.

REFERENCES:
patent: 5559614 (1996-09-01), Urbish et al.
patent: 5949502 (1999-09-01), Matsunaga et al.
patent: 6040812 (2000-03-01), Lewis
patent: 6437764 (2002-08-01), Suzuki et al.
patent: 6525342 (2003-02-01), Amemiya et al.
patent: 6680761 (2004-01-01), Greene et al.
patent: 2002/0044329 (2002-04-01), Shoji
patent: 2002/0047982 (2002-04-01), Sonoda et al.
patent: 2003/0107565 (2003-06-01), Libsch et al.
patent: 2003/0107696 (2003-06-01), Song
patent: 2004/0055785 (2004-03-01), Ben-Shalom
Kawachi et al., “A Novel Technology for A-SI TFT-LCD's With Buried ITO Electrode Structure,” IEEE, Jul. 1994, pp. 1120-1124.
Harvey et al., “Laser Cutting Thin Films for Solar Panels,” IEEE, May 1996, pp. 1.
Choi et al., “Design of Solar Cell Array Preventing Electrostatic Discharge for Satellite Use,” IEEE, Aug. 1997, pp. 416-421.
Charruau, “Modeling Electrical Conductive of Anisotropic Chemical Adhesives,” IEEE, Jun. 23-26, 2002, pp. 7-12.
Jeng et al., “Application of A1/P1 Composite Bumps to COG Bonding Process,” IEEE, Jun. 2001, pp. 271-278.
Zhang et al., “A Novel Self-Aligned Bidirectional MIM Diode With Transparent Junction of AM-LCD's,” IEEE, Jun. 1998, pp. 192-194.
Ito et al., “Analysis and Design of Distributed EDS Protection Circuits for High-Speed Mixed-Signal and RF ICs,” IEEE, Aug. 2002, pp. 1444-1454.
Kristiansen et al., “Overview of Conductive Adhesive Interconnection Technologies for LCD's,” IEEE, 1997, pp. 223-232.

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