Method for manufacturing thin semiconductor chip

Details Method for manufacturing thin semiconductor chip Method for manufacturing thin semiconductor chip

2005-12-13

2005-12-13

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S460000

Reexamination Certificate

active

06974721

ABSTRACT:
In manufacturing a thin semiconductor chip, a wafer is stably held during processing to maintain a stable shape and to avoid generation of cracks on the wafer. When a thin wafer having a surface thereon is to be processed, a rigid support body is adhered to the other surface of the thin wafer and a ring-shaped frame, encircling an outer periphery of the thin wafer, is adhered to the rigid support body.

REFERENCES:
patent: 5268065 (1993-12-01), Grupen-Shemansky
patent: 5891298 (1999-04-01), Kuroda et al.
patent: 6297131 (2001-10-01), Yamada et al.
patent: 2002-100589 (2002-04-01), None

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