Lead and socket structures with reduced self-inductance

Details Lead and socket structures with reduced self-inductance Lead and socket structures with reduced self-inductance

1990-01-31

1992-08-11

LaRoche, Eugene R.

357 74, H01L 2348

Patent

active

051384310

ABSTRACT:
Where a lead frame or lead structure in a plastic or ceramic-type package is made of a ferromagnetic material, an electrically conducting non-ferromagnetic material is added to create a low-inductance path between a semiconductor die and the terminals of the package to reduce self-inductance in the package. To provide an effective low-inductance current path to the ferromagnetic lead frame, the cross-sectional dimensions of the non-ferromagnetic path is preferably no less than 50 microinches. Where the lead frame or lead structure is made from an electrically conducting non-ferromagnetic material, a ferromagnetic material is added to provide strength and rigidity to the lead frame or lead structure. The material added may be plated, spot plated, or cladded onto the starting material. The leads or terminals of a socket may be also be constructed in a similar manner to improve its wear-resistance and rigidity while maintaining a low self-inductance.

REFERENCES:
patent: 4372809 (1983-02-01), Grewal et al.
patent: 4441119 (1984-04-01), Link
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4761518 (1988-08-01), Butt et al.
patent: 4835593 (1989-05-01), Arnold et al.

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