Nitride semiconductor substrate production method thereof...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – With lattice constant mismatch

Reexamination Certificate

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C257S103000, C257S627000

Reexamination Certificate

active

06967359

ABSTRACT:
Disclosed are a nitride semiconductor substrate and a production method thereof. Seed crystals made of GaN or AlGaN with a relatively low AlN molar fraction is selectively grown on a first group-III nitride semiconductor, such as GaN, to have a specific crystal face. Then, on the seed crystals, an AlGaN with a high AlN molar fraction is grown through a second group-III nitride semiconductor, such as AlN deposited at a low temperature. The present invention can provide an AlGaN-crystal substrate having a low dislocation density in a wide area without any crack, and a high-performance short-wavelength optical device using the substrate.

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Shugo Nitta et al., Mass Transport and the reduction of threading dislocation in GaN. Applied Surface Science 2000, vol. 159-160, pp. 421-426.
Hiroshi Amano et al., Effect of Low-temperature Deposited Layer on the Growth of Group-III Nitride on Sapphire, 2000, vol. 21, No. 3, pp. 126-133.
Toshio Nishida et al., Efficient and high-power AIGaN-based ultraviolet light-emitting diode grown on bulk GaN, Applied Science Letters, American Institute of Physics, Aug. 6, 2001, vol. 79, No. 6, pp. 711-712.
Muhammad Asif Khan et al., Stripe Geometry Ultraviolet Light Emitting Diodes at 305 Nanometers Using Quaternary AI InGaN Multiple Quantum Well, The Japan Society of Applied Physics, Jpn. J. Appl. Phys., Dec. 1, 2001, vol. 40, Part 2, No. 12A, pp. L1308-L1310.

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