Method for controlling galvanic corrosion effects on a...

Details Method for controlling galvanic corrosion effects on a... Method for controlling galvanic corrosion effects on a...

2005-02-22

2005-02-22

El-Arini, Zeinab (Department: 1746)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S032000, C134S033000, C134S902000, C134S010000

Reexamination Certificate

active

06858091

ABSTRACT:
A method for minimizing galvanic corrosion effects in a single-wafer cleaning system is provided. The method initiates with spraying a cleaning chemistry containing corrosion inhibitors onto a surface of a wafer. Then, the surface of the wafer is exposed to the cleaning chemistry for a period of time. Next, a concentration gradient at an interface of the cleaning chemistry and the surface of the wafer is refreshed. Then, a rinsing agent and a drying agent are applied simultaneously to remove the cleaning chemistry, wherein the drying agent dries the surface of the wafer prior to a concentration of the corrosion inhibitors being diluted to a level insufficient to provide corrosion protection.

REFERENCES:
patent: 5705089 (1998-01-01), Sugihara et al.
patent: 6152153 (2000-11-01), Takase et al.
patent: 6247479 (2001-06-01), Taniyama et al.
patent: 6265781 (2001-07-01), Andreas
patent: 1 039 506 (2000-09-01), None

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