Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-02-22
2005-02-22
Graybill, David E. (Department: 2827)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S106000, C438S112000, C438S123000, C438S127000
Reexamination Certificate
active
06858453
ABSTRACT:
An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.
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Corisis David J.
Cram Daniel
Nevill Leland R.
Reynolds Tracy
Slaughter Michael
Graybill David E.
Micro)n Technology, Inc.
TraskBritt
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