4. Semiconductor device manufacturing: process
  5. With measuring or testing
  6. Packaging or treatment of packaged semiconductor

Michael Slaughter

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Integrated circuit package alignment feature

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Integrated circuit package alignment feature

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Integrated circuit package alignment feature

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent

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Integrated circuit package including lead frame with...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Pusher assemblies for use in microfeature device testing,...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1290173

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