Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-06-14
2005-06-14
Clark, S. V. (Department: 2815)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S613000, C257S779000, C257S780000
Reexamination Certificate
active
06905954
ABSTRACT:
The present invention provides a method for producing a semiconductor device, with the steps of: applying an interconnect level (11, 12) to a semiconductor substrate (10); structuring the interconnect level (12); and applying a solder layer (13) on the structured interconnect level (11, 12) in such a way that the solder layer (13) assumes the structure of the interconnect level (11, 12). The present invention likewise provides such a semiconductor device.
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Hedler Harry
Meyer Thorsten
Vasquez Barbara
Clark S. V.
Jenkins & Wilson & Taylor, P.A.
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