Method to fabricate passive components using conductive polymer

Details Method to fabricate passive components using conductive polymer Method to fabricate passive components using conductive polymer

2005-10-25

2005-10-25

Thomas, Tom (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S296000, C257S528000, C257S531000, C257S536000

Reexamination Certificate

active

06958522

ABSTRACT:
A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.

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patent: 6108212 (2000-08-01), Lach et al.
patent: 6210537 (2001-04-01), Murphy et al.
patent: 6291305 (2001-09-01), Huang et al.
patent: 402273926 (1990-11-01), None
patent: 407058439 (1995-03-01), None
PCT International Search Report, PCT/US02/16290, 3 pages.

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